Just in December, the Chipset Giant Qualcomm gave us a sneak peek into the New Line-up of the Qualcomm Chipsets. Just today we have been getting leaks from WEIBO (Chinese) about the next lineup of Chipsets for 2018. They are namely Snapdragon 670, 640, and 460. This has reveled after few weeks since the leaks of Snapdragon 845 which would be powering the Flagships of 2018! *cough cough* Huawei. Let’s have a look at the new leaks:
It would be the successor to SD660. Being build on 10nm fabrication, it would be more power-efficient. It would be packed with the new Dual 14-bit Spectra 260 ISP which allows smartphones with single rear camera up to 26MP or dual camera setup (16+16MP)
8 cores (4 x Kryo [email protected]) + (4x Kryo 360 @2GHz)
Modem- X16 LTE CAT.16 (Down- 1GBps; Up- 150MBps)
The mid-end SD640 would be boasting 2 Kryo 360 cores @2.15GHz and other 6 cores @ 1,55GHz with Adreno 610 GPU. It looks to have the same ISP and Modem as the Snapdragon 670.
It is aimed towards affordable smartphones which boast all 8 Kryo 360 cores- ( each [email protected] 1.8GHz + each 4 @1.4GHz). Sadly, it won’t have the same ISP as the one found on the upper Chips, featuring Spectra 240 ISP. So with more compromises, this SD460 would be built on the 14nm fabrication process.
So what do you think about this Future lineup of the Qualcomm Chipsets? Let us know in the comments below!